Master Patterns for Phototooling

1. "ETCH AND FILL PROCESS": Etching the pattern within the substrate surface and filling the etched areas with an opaque fill:

PROCESS STEPS

1. Glass substrate is procured, inspected, and cleaned.
2. Metal Coating applied.
3. Light Sensitive Photoresist applied by spin coating or dip coating.
4. Exposure of the Photoresist pattern by AUTOGRAPH or contact print of a Photo Tool or Mask.
5. Develop Photoresist and Inspect for its masking quality. Areas to be removed will be exposed after Developing.
6. Chemically Etch Metal Coating in exposed areas. Inspect remaining metal/photoresist areas for masking qualities.
7. Chemically Etch Glass substrate. Inspect etched areas for quality.
8. Strip or remove both Photoresist and Metal Coating layers.
9. Fill etched areas within substrate surface with epoxy or other opaque Fill material.
10. Temperature or air cure filled areas of pattern.

2. ETCHED METAL (primarily Chrome) ON SUBSTRATE PROCESS: Metal is evaporative or sputter coated onto the substrate and the clear areas are etched away:

PROCESS STEPS:

1. Glass substrate is procured, inspected and cleaned.
2. Metal Coating is applied. Methods included evaporation, sputtered deposition, electron beam,CVD, and others. Typical for Chrome coating Thin Film Thickness 1200-2000 Å.
3. Light Sensitive Photo Resist applied by spin coating or dip coating.
4. Exposure of the Photoresist pattern by AUTOGRAPH or contact print of a Phototool or Mask.
5. Develop Photoresist and Inspect for its masking quality. Areas to be removed will be exposed after Developing.
6. Chemically Etch Metal Coating in exposed areas.
7. Strip or remove Photoresist leaving the Metal Coating layer on the substrate surface.