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| Max Levy Online > Specialty Products > Bulletin 1370A | |
| Flex Circuits and Metalized Film Bulletin 1370A | |
 | Actual Dimensions: 65.8mm X 21.55mm Trace Widths: 12-24 microns |
| Circuit designers can now use the Space and Weight savings available with MLA produced Flexible Circuitry. Simply layers of Conductors on or within insulators, Flex Circuits will improve connection reliability and simplify electronics assembly. High densities and Ultra Fine Lines to 0.00036” spacing have been achieved with reliability and high quality. Flex Circuitry is ideal for Electronic Packaging and Electrical Interconnects as the alternative to wiring or PCB's. | |
| Their design also allows for use as insulators, RF/EMI sheilding, impedance matching, and encapsulated antenna coils. Since a properly designed Flex Circuit "fits" only one way, it will lower your assembly costs and enhance yeilds. Flex Circuits resist shock and vibrations. Well thought out packaging affords a neater assembly and final product appearance. Various interconnect techniques are available, including surface mount, compression, or Z-axis bonding, wire bonding, and "plug-in" connector types. | |
| APPLICATIONS: Commercial, medical and areospace circuit designers will acheive success with Flex Circuit designs. Commercial customers have used them in printers, scanners, displays, disk drives, and communication products. Their possibilities are endless for machine control and monitoring. As interconnects, their advantages are unsurpassed. | |
| Flex Circuits can be used in CCD detectors, and for directly mounting the detectors and other microelectronic devices. Medical users have applied Flex Circuitry in catheters, pacemakers, and other invasive devices. | |
| End users for military aerospace applications include antenna sheilds, missile and torpedo guidance sensors and controls, avionics, satellite circuits, gyroscopes and various instrumentation. High energy physics research has advanced with custom detectors and detector circuitry. | |
| MATERIALS: SUBSTRATES- can be selected from polyimide films with trade names such as Kapton® and Upilex®. Teflon® limits abrasive wear. Others include Mylar® and various Polyesters. Thicknesses generally range from 0.0005” to 0.005”, but may vary depending on application. Holes as small as Ø0.001” can be accurately positioned. | |
| CONDUCTORS- Copper is the most prevalent, and can be electro-deposited or laminated rolled/annealed sheets. Thicknesses from 1/8oz. (seed) to 3oz. (0.0041”) are commonly used, but may vary as design dictates. Gold, silver, beryllium copper, nickle, cupronickel, inconel, and various other metals can be used. | |
| COVERLAYERS and COVER INSULATORS- usually are the same as or similar to the substrate materials. We can also provide solder masks and UV curing/thermo-setting liquid covers | |
| ADHESIVES- can include a choice of acrylics, modified acrylics, or epoxies. | STIFFENERS- and thicker backing boards can be incorporated. |
| PHYSICAL and ELECTRICAL CAPABILITIES: Most design limitations depend on materials, circuit pattern, and the number of layers. | |
| MAXIMUM SIZE- standard sizes of up to 24” X 96” are available with longer configurations and even continuous rolls possible. | |
| CONDUCTOR THICKNESS- can range from as small as 0.0001” (2500 angstroms). | |
| RESISTANCE, DIELECTRIC STRENGTHS, WIRE WOUND COILS, and RF/EMI SHIELDING- can be designed as suitable for the requirements. | |
| SINGLE LAYERS, MULTI-LAYERS, and COMBINATIONS- by vacuum lamination can be employed. | |
| PLATED-THROUGH HOLES, PADS and LEADS- can be achieved as needed. We can also custom bond connectors. | |
| TOLERANCES- In general, we can achieve tolerances of ±0.000050” on single thin conductors, and ±0.0002” to ±0.0005” on small circuit features. Tolerances over large areas with greater material thickness may vary from ±0.001” to ±0.003”. Alignment of layer to layer can be within Ø0.005” to Ø0.003”. Steel rule or "Class A" die cutting and Precision cutting/drilling are used to achieve finished piece tolerances. | |
| MANUFACTURING TECHNOLOGY: All work is based on Precision Photoetching metal and metalized films. Technical artwork as compensated replication masks or masters can be accurately generated from extremely small sizes to 60” x 120”. The most precise Phototools are chrome on glass. Circuits can be programmed from a sketch or drawing, and we can accept most standard CAD format data files for conversion. | |
| Screen printing, plating, and multi-layer lamination in combination allow the designer to push the State of the Art. Our patented Cermet® on ceramic substrate circuit capabilities increase Packaged Assembly solutions. | |
Ceramic, Cermet/Ceramic Circuitry | |
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Stable, Rugged circuits in difficult temperature
environments, patented High Density Circuits having | |
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